Low CTE, low shrinkage, and high Tg.
Effective to reduce the warpage of substrate for IC package.
Flip Chip Package, CSP, BGA, etc. Application Processor, Baseband, GPU, DRAM, Flash Memory, ECU for Automotive, Sensor, etc.

The excellent properties of low-loss and high-speed transmission for high frequency signal and lower transmission loss performance.
Application High frequency, High speed signal devices.
SiP, Module, CSP, BGA, Flip Chip Package, etc.